Apple is rumored to launch its first foldable iPhone next year, and the A20 series chips will use TSMC’s 2nm

According to "Wccftech" report, Apple plans to introduce its first 2-nanometer process chips A20 and A20 Pro into the iPhone 18 series released next year, and simultaneously launch its first foldable iPhone. Sources pointed out that this product will have multiple SoC variants to correspond to different positioning models.

The report quoted Weibo user "Mobile Chip Expert" as saying that a person involved in Apple's IC design work allegedly revealed that the internal code name of the A20 chip is "Borneo", while the high-end version of the A20 Pro is code-named "Borneo Ultra". According to this statement, the standard version of iPhone 18 will use A20, while the iPhone 18 Pro, Pro Max and folding machines will use A20 Pro. However, Apple has not yet responded to this rumor.

In the previous-generation iPhone 17 series, Apple launched two chips, A19 and A19 Pro, which were actually divided into three versions: iPhone Air uses a lower-frequency version of A19 Pro, while the Pro series is equipped with a complete six-core CPU and GPU. The market speculates that Apple may continue the same strategy this time. Although it only names two chips, it actually still has multiple versions.

On a technical level, the A20 series is expected to use TSMC’s 2-nanometer (N2) process and maintain an architectural design of “2 high-performance cores + 4 high-efficiency cores”. Another source pointed out that Apple’s next-generation M6 chip will also use the same process and will be installed in the 14-inch OLED touch version of MacBook Pro. Looking forward, Apple is expected to introduce the N2P process in 2027 to further advance the 2nm generation product line.

Apple’s A20, A20 Pro Chipset Codenames Revealed – Rumor Provides Details On Which SoC Will Power The iPhone 18 Next Year