CoWoP is expected to take over CoWoS? Foreign investors like this CoWoP concept stock

Recently, the Internet has launched a new packaging technology CoWoP (Chip on Wafer on PCB), and it is said that it may replace CoWoS in the future.

According to the Huaer Street News report, NVIDIA's 12-year technical staff member Anand Mannargudi mentioned a cycle in the company's internal technology briefing, which will transition from CoWoS (Chip on Wafer on Substrate) technology to CoWoP technology.

Traditional CoWoS packaging methods include GPU core and HBM chips (Die), interposer, package substrate (Package Substrate), and then connected to the motherboard (Platform PCB) through BGA.

As for CoWoP, it cuts off the packaging substrate and BGA directly, and uses the development of the "Platform PCB" to allow the "chip and intermediary layer" combination to be installed directly on the motherboard. In this way, the chip's signal can go directly from the intermediary layer to the motherboard, making the connection shorter and better dissipation, etc.

However, the US Foreign Investment issued a latest report stating that Nvidia Rubin Ultra will not use CoWoP, because Japanese manufacturer Ibiden studies that Rubin Ultra's ABF loading panels are much larger than Rubin and have more layers. It will be very difficult to further reduce the width/width (L/S) of the PCB from 20/35 microns to below 10/10 microns.

To adopt CoWoP technology, the PCB width/width distance must be reduced to less than 10/10 microns to be consistent with the current ABF loading level. American External Information pointed out that the average L/S of HDI boards is currently 40/50 microns, and the average SLP (type of loading PCB) used for iPhone motherboards is 20/35 microns.

The US-based external information believes that if we look at the long-term development, CoWoP can simplify the GPU board manufacturing process. Assuming that it will be adopted, it is expected that Taiwanese manufacturers such as Zhending, Huatong, and Xingxing will benefit from the same process technologies as SLP (type of loading), but it may be a negative solution for ABF boards.

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